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Rheological Studies of Silver Nanoparticles Based Isotropic Conductive Adhesive (Ag-ICAs) for Microelectronic Packaging Applications

Liew, Jian Ping (2016) Rheological Studies of Silver Nanoparticles Based Isotropic Conductive Adhesive (Ag-ICAs) for Microelectronic Packaging Applications. Master dissertation/thesis, UTAR.

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    Item Type: Final Year Project / Dissertation / Thesis (Master dissertation/thesis)
    Subjects: T Technology > TJ Mechanical engineering and machinery
    Divisions: Institute of Postgraduate Studies & Research > Lee Kong Chian Faculty of Engineering and Science (LKCFES) - Sg. Long Campus > Master of Engineering Science
    Depositing User: Sg Long Library
    Date Deposited: 11 Oct 2016 11:05
    Last Modified: 14 Aug 2017 11:04
    URI: http://eprints.utar.edu.my/id/eprint/2189

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